Monitoring rapid temperature excursions, ionizing radiation, and board flexure to preempt physical tampering before silicon decapsulation.
Environmental Attack Detection 的技术实现需要专用的芯片物理隔离边界，以防止在并发执行线程中发生内存暴露与侧信道泄露。
遵循 FIPS 140-3 和通用准则（Common Criteria）体系确保 Environmental Attack Detection 能有效抵御侵入式物理探测、低温故障攻击以及数学建模的故障注入。